Multilayer PCB Has More Than Two Conductive Copper Layers

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Multilayer PCB recieve more than 2 conductive copper levels which mainly comprise of inner level cores, prepreg layers and copper foils and they? lso are melted together by means of heat and stress. Lamination process is one of the key to control good quality of multilayer PCB, this process requires specific heating and pressure with regard to specific durations centered on materials accustomed to ensure the PCB board is produced properly.

The multilayer PCB is the particular development of the double sided PCB with increasing difficulty and density regarding components, they granted the designers in order to produce highly complicated and compact circuits and further advancement of blind in addition to buried via hole technology has pressed these limits actually further.

With the requirements of higher precision in several programs, the demands regarding multilayer PCB maintain increasing continuously in recent years. The typical apps of multilayer printed circuit boards contain Computers, Data storage, Cell phone transmission, GPS technology, satellite systems and thus on.

A-TECH is usually an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing method in house through inner layer, vacuum lamination to area finishes, it gives us more advantages in the competition of global market shares for multilayer printed circuit boards on quality, price and lead moment. The proportion regarding multilayer PCB we all manufactured is even more than 65%.

multilayer pcb HDI PCB, the full name is High Density Connect PCB, it requires a lot higher wiring thickness with finer track and spacing, smaller vias and larger connection pad density. Blind and hidden vias? design any of their marked feature. HDI PCB are widely used for Cellular phone, capsule computer, camera, GPS UNIT, LCD module and other different location.

A-TECH CIRCUITS provides HDI PCB manufacturing services to globally customers in the particular top quality automotive industry, medical camera industry, mobile, computing and defense industry.

At present the advanced HDI technology we applied include: “Direct Laser beam Drill”(DLD) is drilling of copper coating by direct CARBON DIOXIDE laser irradiation, out-do additional laser going with conformal cover up, the copper primary laser drilling is capable of providing higher accuracy, better opening quality and better efficiency for HDI projects. “Copper Filled” for special collection microvia, “Laser Immediate Imaging”(LDI) is specifically designed for good line technology, to be able to eliminate dimensional stability problem of art caused by ecological and material issues.